Item ID: 11617

SC BLF03 96,5/Ag3/Cu0,5/T4 13/05

Delivery at your place between May 20 and Jun 24 2025

About the product

The SC BLF03 is a cosequently evolved High-Tech-Product, which is best suitable for all lead-free SMT applications. Its development is not only based on many years of experience on the field of SMT but also the careful and severe consideration of the norms ISO, EN, IPC, and MIL. The SC BLF03 is a homogenous mixture of a lead-free solder powder available in all required alloys and grain sizes, with an organic flux based on synthetic resin corresponding to RE L0 according to J-STD 004 (F-SW32) (exceeds the expectations of RMA!). Thus it belongs to the latest "no-clean" solder paste types.

Technical data

  • minimal (4.3%), highly transparent residue, simplifying the in circuit test
  • a true "no clean" paste
  • contains corrosion inhibitors
  • an outstanding printing quality – for hours
  • an huge adhesive power
  • excellent for fine pitch and super fine pitch applications
  • superior soldering results with all soldering profiles and ovens

Product specifications

Manufacturer SOLDER CHEMISTRY
Leaded No
Flux REL0
Grain size 4
Container Cartridge
Package size (g) 35 mm

Data sheets

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