Production technology
Adhesives
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Dissipation thermique
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Flux
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About the product
The SC BLF03 is a cosequently evolved High-Tech-Product, which is best suitable for all lead-free SMT applications. Its development is not only based on many years of experience on the field of SMT but also the careful and severe consideration of the norms ISO, EN, IPC, and MIL. The SC BLF03 is a homogenous mixture of a lead-free solder powder available in all required alloys and grain sizes, with an organic flux based on synthetic resin corresponding to RE L0 according to J-STD 004 (F-SW32) (exceeds the expectations of RMA!). Thus it belongs to the latest "no-clean" solder paste types.
Technical data
- minimal (4.3%), highly transparent residue, simplifying the in circuit test
- a true "no clean" paste
- contains corrosion inhibitors
- an outstanding printing quality – for hours
- an huge adhesive power
- excellent for fine pitch and super fine pitch applications
- superior soldering results with all soldering profiles and ovens
Product specifications
Manufacturer | SOLDER CHEMISTRY |
Leaded | No |
Flux | REL0 |
Grain size | 4 |
Container | Cartridge with plunger |
Package size (g) | 35 mm |
Data sheets
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