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About the product
- Polytec TC 430 is a solvent-free, two-component, boron nitride-filled, epoxy thermally conductive adhesive.
- Polytec TC 430 is a versatile adhesive for thermal management in electronics, hybrid technology, sensor technology, optronics and much more.
- Polytec TC 430 was specially developed for the bonding of heat sinks in mass production, but is also suitable as a thermally conductive chip adhesive, underfill or as a chip cover.
- It can be applied by dispensing or by hand.
- Due to its non-abrasive filler, Polytec TC 430 is also suitable for processing with dynamic mixing and dosing systems.
Technical data
- Number of components: 2
- Curing (e.g.): 150 °C / 15 minutes
- Temperature range: approx. -55 °C to 250 °C
- Consistency: thixotropic pasty
- Product information: non-abrasive, fine boron nitride filler, high glass transition value (Tg), excellent temperature stability, highly electrically insulating
Product specifications
| Manufacturer | Polytec PT |
| Product | Thermally conductive adhesive |
| Container size (g) | 250 g |
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