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About the product
- Polytec TC 351 is a one-component, stable, heat-curing, thermally conductive epoxy adhesive or encapsulation material with a long pot life and high dielectric strength.
- Polytec TC 351 is ideal for electrically insulating, thermally conductive bonding and encapsulation.
- Polytec TC 351 can be used as an SMD adhesive for fixing components before soldering and as a fixing adhesive for sensors.
- It can be applied by dispensing, screen and stencil printing or by hand.
Technical data
- Number of components: 1
- Curing (e.g.): 150 °C / 10 minutes
- Temperature range: -55 °C to 200 °C
- Consistency: pasty, stable
- Product information: 1-component, electrically insulating, good dispensing properties, high dielectric strength, excellent chemical resistance, long processing time
Product specifications
| Manufacturer | Polytec PT |
| Product | Thermally conductive adhesive |
| Container size (g) | 250 g |
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