Production technology
Adhesives
Cleaning products
Dissipation thermique
Dosing systems
ESD products
Extraction accessories
Extraction filter systems
Flux
Hand tools
Ingot plumb bob
Inspection systems
Maintenance aids
Measuring tools
Occupational safety
Potting compounds
Protective coatings
Protective equipment
Repair stations
Rework stations
Solder bars
Solder pastes
Solder wires
Soldering accessories
Soldering stations
Soldering tips and nozzles
Soldering tools
Suction accessories
Suction filter systems
Vices
About the product
- Polytec TC 451 is a ceramic-filled, two-component, room temperature curing epoxy resin with very good thermal conductivity.
- Polytec TC 451 is preferably used for thermal management in electronic and electrical engineering applications.
- Polytec TC 451 is suitable for potting applications as well as for thermally conductive bonds that require a flowable adhesive.
- Polytec TC 451 is characterized not only by good adhesion to metals (steel, aluminium, non-ferrous metals), ceramics and many plastics, but also by very good thermal and chemical resistance.
- It can be applied by dispensing or by hand.
Technical data
- Number of components: 2
- Curing (e.g.): 23 °C / 24 hours
- Temperature range: approx. -55 °C to 180 °C
- Consistency: easy flowing paste
- Product info: thermally conductive adhesive and potting compound, room temperature curing system, good adhesion to most surfaces
Product specifications
| Manufacturer | Polytec PT |
| Product | Thermally conductive adhesive |
| Container size (g) | 250 g |
Data sheets
Accessories
Related products
Log in
Sign in for full site access, including pricing, ordering, product customization, and more.
Log in