EF270 Flux 25l Bidon

Low-solids no-clean flux of category 2.2.3.A according to DIN-EN 29454-1, type ORL0 according to EN 61190-1-1 and type ORL0 according to J-STD-004. Stannol EasyFlux 270 soldering flux was developed for wave soldering electronic assemblies and as a supplement to the Stannol EasyFlux range. The reduced solids content in combination with specially adapted halogen-free activation results in excellent wetting properties on a wide variety of surfaces (e.g. OSP, Ni/Au, HAL), even with lead-free solder alloys. This flux can also be used for other soldering processes such as selective and dip soldering.

Technical data

• No-Clean
• Low residue
• Resin-free
• Optimum solids content - fast wetting
• Perfect results with lead-free and lead-containing alloys

Areas of application

Stannol EasyFlux 270 is preferably used in spray fluxers. Foam fluxers can be used to a limited extent. The preheating temperature when entering the solder wave should be at least 90°C on the top of the PCB. This temperature ensures that the solvent evaporates and the flux is sufficiently activated. For lead-free soldering processes, the optimum preheating temperature may have to be determined on the basis of the thermal requirements. For selective soldering, the sprayed area should be preheated. Changes in the composition occur due to evaporation losses, so that a correction should be made by correct dilution. The titration method with the Stannol Mini Titration Set is recommended for this purpose. Corresponding instructions are included in the titration set.

Hazard pictograms

Information:

• Dangerous goods, transportation costs may be higher than stated.
• Prices excl. VOC