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About the product
- Polytec TC 432 is a pasty to viscous, thermally highly conductive, room temperature curing adhesive for thermal management in electronics, hybrid technology, sensor technology, energy technology and much more.
- TC 432 has good adhesion to glass, ceramics, metal, FR4 and most plastics.
- Due to its non-abrasive filler, Polytec TC 432 is also suitable for processing with dynamic mixing and dosing systems.
Technical data
- Number of components: 2
- Curing (e.g.): 23 °C / 24 hours
- Consistency: thixotropic paste
- Product information: non-abrasive boron nitride filler, stable, fast curing, high thermal conductivity (1.8 W/mK), highly electrically insulating
Product specifications
| Manufacturer | Polytec PT |
| Product | Thermally conductive adhesive |
| Container size (g) | 250 g |
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