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About the product
- Polytec EP 653 is a two-component, hot-curing epoxy resin adhesive with a long drip time and excellent temperature resistance.
- Polytec EP 653 is suitable for a wide range of applications in sensor technology, piezo technology, fiber optics, optoelectronics, medical and semiconductor technology.
- Polytec EP 653 has excellent adhesion to glass, silicon, ceramics, ferrite, metals and many plastics. Versatile use as an adhesive, impregnation, underfill and sealing material.
- Polytec EP 653 fulfills the requirements of the USP VI biocompatibility standard and is autoclavable.
- It can be applied by dispensing, jet dispensing or manual application.
Technical data
- Number of components: 2
- Curing (e.g.): 150 °C / 5 minutes
- Temperature range: approx. -55 °C to 230 °C
- Consistency: low viscosity
- Product information: USP VI, autoclavable, fiber optic adhesive, potting, medical technology, >500 autoclave cycles
Product specifications
| Manufacturer | Polytec PT |
| Container size (g) | 250 g |
| Product | Epoxy resin adhesive |
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