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About the product
- Description Polytec EP 501 is a one-component, unfilled, solvent-free, heat-curing epoxy resin adhesive.
- Polytec EP 501 adheres excellently to glass, silicon, ceramics, metals and many plastics and forms high-strength bonds.
- Polytec EP 501 cures at temperatures from 120°C and is typically used as an adhesive, glob top and also as a potting material.
- It can be applied by dispensing, screen printing or by hand.
Technical data
- Number of components: 1
- Curing (e.g.): 150 °C / 8-10 minutes
- Temperature range: approx. -55 °C to 180 °C
- Consistency: slightly pasty
- Product info: Coating and potting compound
Product specifications
| Manufacturer | Polytec PT |
| Container size (g) | 250 g |
| Product | Epoxy resin adhesive |
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