Production technology
Adhesives
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Dissipation thermique
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Flux
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About the product
The SC BLF03 is a consistently further developed high-tech product that is ideally suited for all so-called lead-free SMT applications. Its development is based not only on many years of experience in the SMT field, but also on careful and strict compliance with the guidelines of ISO, EN, IPC and MIL standards. In physical terms, SC BLF03 is a uniform mixture of a lead-free soft solder powder, available in all required alloys and grain sizes, with an organic binder based on synthetic resin, which corresponds to RE L0 according to J-STD 004 (F-SW32) (exceeds the RMA requirements!). This makes it one of the very best "no-clean" paste types.
Technical data
- Clear, small (4.5%) backlog, favors the "in circuit" test !
- A true "no clean" paste
- Contains corrosion inhibitors
- Excellent print quality, for hours!
- An enormously high adhesive strength
- The best choice for "fine and super fine pitch" applications
- Flawless soldering results with all common soldering profiles
Product specifications
| Leaded | No |
| Manufacturer | SOLDER CHEMISTRY |
| Flux | REL0 |
| Container | Can |
| Grain size | 4 |
| Container size (g) | 200 g |
Data sheets
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