About the product
Stannol contact solder paste is a preparation of activated rosin resin in mineral fats, Stannol contact solder paste is a flux for soft soldering type 1.1.2.C according to DIN EN 23454-1 (F-SW26) for general soldering work. Stannol contact soldering paste is preferably used for soldering copper and copper alloys, nickel(!) and nickel alloys and is suitable for use in electrical engineering. Cable tinning, soldering of connections, shielding plates and repair of wires are examples of applications. It is not necessary to remove the flux residues as they do not have a corrosive effect.
Application
Solder joints should be clean and free of surface layers, sand if necessary. Apply Stannol contact solder paste to the metal to be soldered. Heat the solder joint with a suitable device (e.g. soldering iron) and add solder. The soldering points should be at least 50 degrees hotter than the melting point (range) of the solder. Solder containing lead, e.g. Sn60Pb40, Pb70Sn30, as well as the lead-free solders Sn99Cu1, Sn96Ag4 are suitable. For applications in electronics, the flux residues must be removed. Stannol contact solder paste is not suitable for drinking and industrial water pipes.
Product specifications
| Manufacturer | STANNOL |
| Container size (g) | 50 g |
| Container | Can |
Data sheets
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