About the product
The solder paste SOLDER CHEMISTRY BLF 04 our latest product, was developed especially for all so called lead free SMT applications. Though thanks to the application of modern chemical substances like plastics and resins, activator systems etc. all our pastes were always able to be combined together with lead free alloys, the latest perceptions in "lead free soldering" have cotributed to this new development. Of course the careful and severe consideration of the norms DIN, EN, IPC and MIL are part of this product, too. The BLF 04 is a homogenous mixture of a lead free solder powder, available in all required alloys and grain sizes, with an organic flux based on synthetic rosin, according to class RE L0 of J-STD[1]005 or RMA-qualifying.
Technical data
- Excellent resistance against humidity.Very long stickiness!
- Forms very homogenous and pipe free solder joints.
- An outstanding printing quality, for hours! Stable Viscosity.
- Few solid substances with only 5.8% residues at 89% content of metal.
- Residues correspond to the RE L0 classification.
- Does not leave any tar residues in your reflow system.
- Soldering without problems even on slightly corroded surfaces
Product specifications
| Manufacturer | SOLDER CHEMISTRY |
| Leaded | No |
| Flux | REL0 |
| Grain size | 4 |
| Container | Cartridge with plunger |
| Package size (g) | 35 mm |
Data sheets
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