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About the product
- Polytec EC 101 is a solvent-free, two-component, heat-curing epoxy resin adhesive with a long drip time and excellent electrical conductivity.
- Polytec EC 101 is suitable for applications in chip assembly, microelectronics, hybrid technology, optoelectronics and medical technology.
- Curing is possible from 95°C.
- Polytec EC 101 fulfills the requirements of the USP VI biocompatibility standard.
- It can be applied by dispensing, jet dispensing or manual application.
Technical data
- Number of components: 2
- Curing (e.g.): 120 °C / 15 minutes
- Temperature range: approx. -55 °C to +200 °C
- Consistency: pasty
- Product information: Standard silver conductive adhesive, COB technology, jet dispenser, USP VI, medical technology
Product specifications
| Manufacturer | Polytec PT |
| Product | Electrically conductive adhesive |
| Container size (g) | 250 g |
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