Production technology
Adhesives
Cleaning products
Dissipation thermique
Dosing systems
ESD products
Extraction accessories
Extraction filter systems
Flux
Hand tools
Ingot plumb bob
Inspection systems
Maintenance aids
Measuring tools
Occupational safety
Potting compounds
Protective coatings
Protective equipment
Repair stations
Rework stations
Solder bars
Solder pastes
Solder wires
Soldering accessories
Soldering stations
Soldering tips and nozzles
Soldering tools
Suction accessories
Suction filter systems
Vices
About the product
- Description Polytec EP 655 is a solvent-free, two-component, low-viscosity, viscoplastic epoxy adhesive with a long pot life and excellent moisture and temperature resistance. It is a very durable adhesive for demanding bonding applications in semiconductor technology and hybrid technology,
- Piezo technology, fiber optic technology, optics, sensor technology and in medical technology.
- Polytec EP 655 has excellent adhesion to glass, metal, ceramics, ferrite and most plastics. Versatile use as an adhesive and potting compound. Its visco-elastic properties allow potting and bonding of components with moderately different expansion coefficients.
- It can be applied by dispensing, jet dispensing or manual application.
Technical data
- Number of components: 2
- Curing (e.g.): 80 °C / 90 minutes
- Temperature range: approx. -55 °C to 220 °C
- Consistency: low viscosity
- Product information: Tough-elastic modified, extremely moisture and chemical resistant, autoclavable epoxy adhesive. Potting and bonding of components with different expansion coefficients
Product specifications
| Manufacturer | Polytec PT |
| Container size (g) | 250 g |
| Product | Epoxy resin adhesive |
Data sheets
Accessories
Related products
Log in
Sign in for full site access, including pricing, ordering, product customization, and more.
Log in