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About the product
The solder paste SOLDER CHEMISTRY BLF 04 has been developed for all lead-free SMT applications.
Technical data
- Excellent resistance to moisture. Very long tack
- Excellent print quality, for hours! Stable viscosity
- A low-solids paste with only 5.8% residue and 89% metal content
- The residues correspond to the RE L0 classification
- Leaves no tar-like residues in the soldering system
- Solders easily even on slightly corroded surfaces
Product specifications
| Leaded | No |
| Manufacturer | SOLDER CHEMISTRY |
| Flux | REL0 |
| Container | Can |
| Grain size | 4 |
| Container size (g) | 200 g |
Data sheets
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