Item ID: 51364

SC BLF02 96.5/Ag3/Cu0.5/T4 11/02 Can 500g

Delivery at your place between May 20 and Jun 24 2025

About the product

The solder paste SOLDER CHEMISTRY BLF 02 is a sophisticated high-tech product that is ideally suited for all so-called lead-free SMT applications. Its development is based not only on the latest findings in soldering chemistry, many years of experience in the SMT field and long-term cooperation with users of vapor phase soldering systems, but also on careful and strict compliance with the guidelines of ISO, EN, IPC and MIL standards. In physical terms, BLF 02 is a uniform mixture of a lead-free solder powder, available in all required alloys and grain sizes, with an organic binder based on synthetic resin, which corresponds to class RE L0 according to J-STD-005 or RMA qualification.

Technical data
  • A low-solids paste with only 4.6% residue.
  • The residues correspond to the RE-L0 classification.
  • Contains corrosion inhibitors.
  • Excellent print quality, for hours on end!
  • Leaves no tar-like residues in the soldering system.
  • Solders easily even on slightly corroded surfaces.

Product specifications

Leaded No
Manufacturer SOLDER CHEMISTRY
Flux REL0
Container Can
Container size (g) 500 g
Grain size 4

Data sheets

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