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About the product
The Stannol SP2200 solder paste has been developed for use with the alloy TSC405 (Sn95.5Ag4Cu0.5) and TSC305 (Sn96.5Ag3Cu0.5) as standard alloys. It contains a highly active type L no-clean flux. With a special formula for excellent wetting, it meets the requirements of high volume production where components and PCBs often have less than optimum solderability. The wetting properties have been optimized for all known lead-free PCB and component coatings. The small amounts of residue after reflow are electrically safe and do not need to be removed.
Technical data
- Alloy Sn95.5Ag4Cu0.5
- Grain class 3 (25-45µm)
- Halogen-free activated
- No-Clean
- Flux type REL0 (IEC 61190-1-3) / 1.2.3.C (DIN EN 29454-1)
- High wet adhesive strength for use on high-speed placement machines
Product specifications
| Manufacturer | STANNOL |
| Leaded | No |
| Flux | REL0 |
| Container | Can |
| Container size (g) | 500 g |
| Grain size | 3 |
Data sheets
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