Desoldering braid No Clean SD ESD Safe 5.3 mm x 1.5 m

The Soder-Wick No Clean desoldering wick has been developed to enable fast and safe desoldering without leaving harmful flux residues. Soder-Wick No Clean desoldering wick uses pure, oxygen-free copper braid and patented flux technology to produce an efficient and effective desoldering braid.

Technical data

• Patented non-corrosive, halogen-free, organic no-clean flux
• Dissolves up to 40 % faster than no-clean braids from other manufacturers and leaves PCBs cleaner
• Complies with Bellcore TR-NWT-000078 and ANSI IPC SF-818 for surface insulation resistance
• MIL-F-14256 F
• NASA-STD-8739.3 Soldered electrical connections
• DOD-STD-883E, procedure 2022
• ANSI/IPC J STD-004, type ROL0
• Complies with MIL-STD-883B, Bellcore TR-NWT-000078, ANSI/IPC J SF-818
• Meets the solderability parameters tested by the Singapore Institute of Standards and Industrial Research (SISIR)