Chemtronics thermal paste, boron nitride, CircuitWorks®, syringe, 3.4g

CircuitWorks® Thermal Paste facilitates heat dissipation from electrical/electronic components. This heavy consistency material is thickened with a thermally conductive filler to provide a positive heat sink seal in electrical/electronic devices.

• Facilitates heat transfer between circuit components and heat sinks
• Excellent thermal and dielectric properties
• Does not dry out, does not harden and does not melt
• Non-corrosive and non-flammable

Technical data

• Offers maximum thermal conductivity with excellent dielectric properties
• Silicone-free connection does not harden or dry out
• Thermally stable from -99ºF (-73ºC) to 392ºF (200ºC)
• Exceeds MIL-C-47113 for thermal conductivity