SC BLF083 96.5/Ag3/Cu0.5/T4 12/01 Tin 200g

The solder paste SOLDER CHEMISTRY BLF083 is a consistent further development with regard to irrevocably introduced lead-free SMT soldering processes and the customer's request for a paste that is easier to print and adheres for a very long time, in order to be able to bridge the sometimes days-long downtimes between printing and assembly and also be very low in odor. Our "trademarks", i.e. minimal residues on the PCB that remain close to the solder joint after soldering, void-free solder joints and no cold storage, should be retained. The use of the latest types of modified plastics and rheology additives in the solder paste and the resulting excellent combination possibilities with lead-free alloys, as well as the latest findings in SMT, have contributed to this further development. Careful and strict compliance with the guidelines of ISO, EN, IPC and MIL standards was also a matter of course. From a physical point of view, BLF083 is a uniform mixture of a lead-free solder powder, available in all required alloys and grain sizes, with an organic binder based on synthetic resin, which corresponds to class RE L0 according to DIN EN61190-1-1 or RMA qualification.

Technical data

• Excellent resistance to moisture. Sticky for days!!!
• Forms very homogeneous, void-free solder joints!
• Solders excellently, even on slightly corroded surfaces. (QFN form!)
• The residues are absolutely halogen-free. (RE L0 classification)
• An even better print quality, as usual!
• Naturally leaves no tar-like residues in the soldering system.
• Minimal, barely visible residue. No soldering beads.