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About the product
The STANNOL SP2200D solder paste has been developed for use with the alloy TSC305 (Sn96.5Ag3.0Cu0.5) and others. It contains a highly active type L no-clean flux. With a special formula for excellent wetting, it meets the requirements of high volume production where components and PCBs often have less than optimum solderability. The wetting properties have been optimized for all known lead-free PCB and component coatings. The small amounts of residue after reflow are electrically safe and do not need to be removed.
Technical data
- Specially developed for use with lead-free alloys
- Reflow under air or nitrogen possible
- Very good wetting on most surfaces, including Ni and Pd
- Processing temperature 20-32°C
- High wet adhesive strength for use on high-speed placement machines
- Good dispensing properties
Product specifications
| Manufacturer | STANNOL |
| Leaded | No |
| Flux | REL0 |
| Container | Cartridge |
| Grain size | 3 |
| Container size (g) | 110 g |
Data sheets
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