Solid solder wire, Sn96.5Ag3Cu0.5 - TSC305, 3 mm, 4000g

STANNOL solid wire is manufactured from high-purity metals. STANNOL's laboratory has established that alloys with a lower degree of purity impair the flow properties and wetting forces of the molten solder. The soldering speed decreases, the amount of solder per solder joint increases and the adhesion force is reduced. It is therefore obvious that the cheapest solder, which is only produced according to general specifications, is not necessarily the most economical in terms of solder wire consumption, productivity and reliability.

Technical data

- Precise diameters without surface irregularities
. - High-purity solder for demanding soldering tasks
. - Lead-free alloys WEEE and RoHS compliant

APPLICATION

The use in small solder baths or the refilling of larger solder baths are two of the most common applications for solid wire. By feeding the solder wire slowly and continuously into the solder bath, the filling quantity remains as constant as possible without suddenly reducing the operating temperature. There are also some applications in which the use of solid wire plus separate flux is more advantageous than the use of a flux-filled solder wire. For example, when joining metal parts where exceptional capillary penetration of the solder is required, a separate paste or liquid flux is applied to the gap before the parts are joined. During the soldering process, the solder melts and is drawn into the soldering gap by the capillary forces of the flux.