MRS-1100A Modular rework system

The MRS-1100A modular rework system is based on convection heat and is designed for the removal and placement of BGA and SMT components.

The manual rework system consists of a manually guided hot air system, an underheater, a stand for the hot air pen and a PCB holder. A large selection of hot air nozzles for various applications complete the system modules.

Technical data

• Digital display for information on temperature and profile sequence
• Underheating with closed control loop for process-safe rework
• Simple profile creation and repeatable processes
• Integrated vacuum pipette for easy removal of components
• The hot air handpiece can be guided manually or fixed in the multifunctional stand
  
• Manual operating mode for quick adjustment
• External thermal sensors for profiling and verification
• Digitally controlled fan to control the air flow
• X, Y, Z and theta adjustments for aligning the component
• Adjustable PCB holder for easy alignment of the PCB
• Automatic lifting of the component using a vacuum pipette
• Soldering profiles can be protected with a password