Item ID: 43868

Chemtronics thermal paste, boron nitride, CircuitWorks®, syringe, 3.4g

Delivery at your place between May 20 and Jun 24 2025

About the product

CircuitWorks® Thermal Paste facilitates heat dissipation from electrical/electronic components. This heavy consistency material is thickened with a thermally conductive filler to provide a positive heat sink seal in electrical/electronic devices.

  • Facilitates heat transfer between circuit components and heat sinks
  • Excellent thermal and dielectric properties
  • Does not dry out, does not harden and does not melt
  • Non-corrosive and non-flammable
Technical data
  • Offers maximum thermal conductivity with excellent dielectric properties
  • Silicone-free connection does not harden or dry out
  • Thermally stable from -99ºF (-73ºC) to 392ºF (200ºC)
  • Exceeds MIL-C-47113 for thermal conductivity

Product specifications

Manufacturer Chemtronics
Container Cartridge
Material Silicone-free thermally conductive pastes
Container size (ml) 50 ml

Data sheets

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